Articles explaining Smart Cards Page 2

Two-day technology and operational expertise conference

On September 27, RFID & Wireless IoT tomorrow, the leading European event for RFID and wireless IoT technologies, opens its doors! At the two-day event, providers and users present the newest technological developments, as well as successful process optimisation with RFID, NFC, BLE, LPWAN, Wi-Fi, and more.

Supporting and honouring the use of RFID & Wireless IoT

Since the first issue of “RFID im Blick”, the German sister magazine of “RFID & Wireless IoT Global”, over eleven years ago, the magazine's editorial staff is tirelessly promoting the use of RFID technology in a wide variety of application areas. Therefore, it is time to send a signal: With the RFID & Wireless IoT Solutions Award, “RFID im Blick” commits to honouring companies which have successfully implemented RFID and wireless IoT solutions. The award is a signal aimed at supporting the digital transformation process across all industries. With the Solutions Award, RFID & Wireless IoT tomorrow is committing to its role as the leading European conference and exhibition for pioneering technological innovation and operational expertise.

Identification, sensors, security, and more on September 27 and 28 in Düsseldorf

On September 27 and 28, the 60 most experienced companies for RFID and wireless IoT meet in Düsseldorf for RFID & Wireless IoT tomorrow, the can't-miss event for innovative technologies. Benefit from the great diversity on offer and meet hardware and component manufacturers, system integrators, software providers, consultants, and research institutes.

Experience new developments and use case scenarios for RFID, NFC, BLE, LPWAN, Wi-Fi, and other wireless technologies. In order to accommodate all exhibitors in 2017, the exhibition floor had to be expanded twice already. Register now and meet experts from all over the world!

Get all background information in the May 2017 issue of „RFID im Blick“

While other cities are still working on theories, Santander is putting “Smart City” concepts into practice. Since 2009, the Spanish city is continuously implementing smart applications on all levels of the city – with no end in sight. Whether smart garbage containers, sensor-controlled traffic or digital citizen participation, in Santander the sky is the limit when it comes to innovation.

NXP to provide smart city technologies to Columbus, OH, winner of the U.S. Department of Transportation’s Smart City Challenge

NXP Semiconductors N.V. announced that its highly advanced technologies for smart cities, including sophisticated vehicle communications solutions, RFID tagging and Smart Card ICs, play a key role in Columbus, Ohio’s winning proposal for the U.S. Department of Transportation’s (D.O.T.) Smart City Challenge. NXP, through its partnership with the D.O.T., is working with Columbus to help deploy wireless technology allowing cars to securely exchange data, prevent accidents and improve traffic flow, as well as Smart Card ICs to make secure public transportation access fast and easy for credit- and cash-economy-based passengers alike.

By “RFID im Blick“ with information from NXP

Visa and Mastercard granted approval to Smartrac’s wire booster antenna, valid in connection with Infineon’s SLJ 32 Payment EMV solution product and Infineon`s innovative “Coil on Module” chip packaging technology. Card manufacturers will benefit from a simplified approval process for their own products based on that combination.

Smartrac’s wire booster antenna has received Visa's Letter of Approval (LoA) and Mastercard’s Component Confirmatory Statement (CCS) in connection with Infineon SLJ 32 payment solution. It is based on Infineon's proven SLE 77 chip platform and incorporates a Java OS with Visa's latest 2.8.1.g and Mastercard M/Chip Advance v1.1 applet. As of now, card manufacturers can refer to these approvals in their own product approval process and thereby significantly reduce time to market and costs. Approved products can be used until the end of 2023 for Visa and until September 2019 for Mastercard.

RFID inlays are manufactured throughout the world for many purposes: for biometric passports, the contactless smart card market (e-ID, electronic healthcare cards, payment cards, public transportation) and for dual interface applications. At the same time, wire-embedded HF-RFID antennas are available and offer a number of advantages over printed, etched or galvanized variations. Among others, the ability to freely select shapes is enticing for card and passport manufacturers, since this can lead to competitive advantages. Further benefits such as environmental friendliness, durability and improved product quality should also be mentioned.

RFID and IoT pacesetter Smartrac is launching Dual Frequency PRELAM®, its latest RFID inlay ideally suited for convenient public transport applications. The new product combines one pre-laminated inlay (PRELAM) with two secure contactless chips, one working in high frequency (HF) and the other in ultra-high frequency (UHF), in a single card.

The capability of such a dual frequency card allows transport operators to select the type of revenue collection method that is appropriate at the point of entry. For example, transport operators can allow for hands-free or Be-in-Be-Out (BIBO) fare collection in very large human traffic channels or for physically challenged commuters. In standard entry or exit, Check-in-Check-Out (CICO) fare collection reader terminals can be deployed.

Short lead times – specialized centers of excellence – long-term experience - comprehensive production facilities & services

As one of few large providers in Europe, exceet Card Group is able to deliver comprehensive services, including design, development, consulting, production, personalization and lettershop from one source. The card specialist has broad experience in all available printing technologies and is able to guarantee extremely short lead times due to production sides in Western Europe.

Fabian Rau, Head of Segment Logical Access Solutions, Exceet Card Group

RFID and IoT pacesetter Smartrac today announced that it has finalized an agreement to sell its Secure ID & Transactions Business Division to the Linxens Group.

Headquartered near Paris, France, Linxens is a global leader in the design and manufacture of smartcard connectors, inlays and LED light sources. The company’s connector products are a vital component of smartcards, enabling the communications and transactions that are central to financial and public sector applications used by a wide range of consumers, including banking cards, SIMs for mobile telephony, ID and health cards, and many more.